Methods and apparatus for adjusting wafer performance using multiple RF generators
US11655540B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 26, 2020 |
| Grant date | May 23, 2023 |
| Priority date | — |
| Expiry date | Dec 5, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/32935
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Methods and apparatus for controlling a semiconductor process leverage phase shifting between at least two RF generators to improve wafer performance parameters. In some embodiments, an apparatus may include a first radio frequency (RF) generator, a second RF frequency generator, a cable connected between the first RF generator and the second RF generator wherein the cable is configured to synchronize the first RF generator and the second RF generator, and an adjustable phase shift assembly with a two-dimensional trace and an adjustable contact point. The adjustable phase shift assembly is connected to the cable and configured to alter at least one water performance parameter by changing a phase shift relationship between the first RF frequency generator and the second RF frequency generator.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.