Advanced reverse treated electrodeposited copper foil and copper clad laminate using the same
US11655555B2 · kind B2 · utility
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3References
19Claims
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Key dates
| Filing date | Jun 12, 2020 |
| Grant date | May 23, 2023 |
| Priority date | — |
| Expiry date | Aug 24, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0355
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An advanced reverse treated electrodeposited copper foil and a copper clad laminate using the same are provided. The advanced reverse treated electrodeposited copper foil has an uneven micro-roughened surface. The micro-roughened surface has a plurality of copper crystals, a plurality of copper whiskers and a plurality of copper crystal groups, which are in a non-uniform distribution to form a non-uniformly distributed horizontal or vertical stripe pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.