Heat treatment apparatus and temperature control method
US11656126B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 15, 2019 |
| Grant date | May 23, 2023 |
| Priority date | — |
| Expiry date | Jun 11, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68771
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
There is provided a heat treatment apparatus for performing a predetermined film forming process on a substrate by mounting the substrate on a surface of a rotary table installed in a processing vessel and heating the substrate by a heating part while rotating the rotary table. The heat treatment apparatus includes: a first temperature measuring part of a contact-type configured to measure a temperature of the heating part; a second temperature measuring part of a non-contact type configured to measure a temperature of the substrate mounted on the rotary table in a state where the rotary table is being rotated; and a temperature control part configured to control the heating part based on a first measurement value measured by the first temperature measuring part and a second measurement value measured by the second temperature measuring part.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.