RFI free picture frame metal stiffener

US11658127B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Eng Huat Goh · Air Itam, MY
• Jiun Hann Sir · Air Itam, MY
• Khang Choong Yong · Puchong, MY
• Boon Ping Koh · Permatang Janggus, MY
• Wil Choon Song · Bayan Lepas, MY
• Min Suet Lim · Kampung Bukit Kechil, MY

Key dates

• Filing date: Jun 27, 2019
• Grant date: May 23, 2023
• Expiry date: Sep 19, 2041

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/1715
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Embodiments include semiconductor packages and method of forming the semiconductor packages. A semiconductor package includes a package substrate on a substrate, a die on the package substrate, and a conductive stiffener over the package substrate and the substrate. The conductive stiffener surrounds the package substrate, where the conductive stiffener has a top portion and a plurality of sidewalls, and where the top portion is directly disposed on the package substrate, and the sidewalls are vertically disposed on the substrate. The semiconductor package also includes the substrate that has a plurality of conductive pads, where the conductive pads are conductively coupled to a ground source. The conductive stiffener may conductively couple the package substrate to the conductive pads of the substrate. The top portion may have a cavity that surrounds the die, where the top portion is directly disposed on a plurality of outer edges of the package substrate.