Device, package and/or substrate comprising curved antenna
US11658403B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 25, 2020 |
| Grant date | May 23, 2023 |
| Priority date | — |
| Expiry date | Oct 12, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q21/06
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A substrate that includes at least one dielectric layer, a plurality of interconnects, and a curved antenna coupled to a surface of the substrate. The curved antenna is curved relative to the surface of the substrate such that at least part of the curved antenna is offset from the surface of the substrate. The substrate includes a first antenna dielectric layer coupled to the surface of the substrate, an antenna ground interconnect coupled to the first antenna dielectric layer, and a second antenna dielectric layer coupled to the antenna ground interconnect. The antenna ground interconnect configured to be coupled to ground. The curved antenna is coupled to the second antenna dielectric layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.