Boron nitride agglomerate, thermosetting resin composition containing same, and use thereof
US11661378B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 23, 2018 |
| Grant date | May 30, 2023 |
| Priority date | — |
| Expiry date | Dec 5, 2038 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09K5/14
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Provided is a boron nitride agglomerate. The boron nitride agglomerate is of a multi-stage structure formed by arranging flaky hexagonal boron nitride primary particles in three-dimensional directions through adhesion of an inorganic binder. Further provided is a method for preparing the boron nitride agglomerate. The method comprises: mixing flaky hexagonal boron nitride primary particles with an inorganic binder, and controlling the mass of the inorganic binder to account for 0.02-20% of the mass of the flaky hexagonal boron nitride primary particles, so as to obtain the boron nitride agglomerate. The boron nitride agglomerate provided can be added to thermosetting resin compositions, and resin sheets, resin composite metal foil, prepregs, laminates, metal foil-covered laminates, and printed wiring boards prepared using the same have higher boron nitride addition, high thermal conductivity, and high peel strength.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.