Bevel edge removal methods, tools, and systems
US11664213B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 26, 2019 |
| Grant date | May 30, 2023 |
| Priority date | — |
| Expiry date | May 7, 2040 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA46B2200/30
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A tool and methods of removing films from bevel regions of wafers are disclosed. The bevel film removal tool includes an inner motor nested within an outer motor and a bevel brush secured to the outer motor. The bevel brush is adjustable radially outward to allow the wafer to be inserted in the bevel brush and to be secured to the inner motor. The bevel brush is adjustable radially inward to engage one or more sections of the bevel brush and to bring the bevel brush in contact with a bevel region of the wafer. Once engaged, a solution may be dispensed at the engaged sections of the bevel brush and the inner motor and the outer motor may be rotated such that the bevel brush is rotated against the wafer such that the bevel films of the wafer are both chemically and mechanically removed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.