Substrate processing method and substrate processing apparatus
US11664263B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 23, 2021 |
| Grant date | May 30, 2023 |
| Priority date | — |
| Expiry date | Dec 1, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68742
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate processing method is provided. The method includes a) causing a substrate to be attracted to an electrostatic chuck, and b) processing the substrate. The method includes c) determining a charge removal temperature based on information preliminarily stored in a storage, thereby adjusting a surface temperature of the electrostatic chuck to be greater than or equal to the determined charge removal temperature, the information indicating a relationship between a maximum surface temperature of the electrostatic chuck, during substrate processing, and a residual charge amount for the processed substrate. The method includes d) removing a charge from the processed substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.