Lithographic apparatus, method for unloading a substrate and method for loading a substrate
US11664264B2 · kind B2 · utility
Assignee
Inventors
- Andre Bernardus Jeunink
- Robby Franciscus Josephus MARTENS
- Youssef Karel Maria De Vos
- Ringo Petrus Cornelis VAN DORST
- Gerhard Albert TEN BRINKE
- Dirk Jerome Andre SENDEN
- Coen Hubertus Matheus Baltis
- Justin Johannes Hermanus Gerritzen
- Jelmer Mattheüs KAMMINGA
- Evelyn Wallis Pacitti
- Thomas POIESZ
- Arie Cornelis Scheiberlich
- Bert Dirk SCHOLTEN
- Andre Schreuder
- Abraham Alexander Soethoudt
- Siegfried Alexander Tromp
- Yuri Johannes Gabriël Van De Vijver
Key dates
| Filing date | Dec 22, 2016 |
| Grant date | May 30, 2023 |
| Priority date | — |
| Expiry date | Jun 19, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68742
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for unloading a substrate from a support table configured to support the substrate, the method including: supplying gas to a gap between a base surface of the support table and the substrate via a plurality of gas flow openings in the support table, wherein during an initial phase of unloading the gas is supplied through at least one gas flow opening in an outer region of the support table and not through any gas flow opening in a central region of the support table radially inward of the outer region, and during a subsequent phase of unloading the gas is supplied through at least one gas flow opening in the outer region and at least one gas flow opening in the central region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.