Weight optimized stiffener and sealing structure for direct liquid cooled modules
US11664329B2 · kind B2 · utility
0Cited by
6References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 19, 2020 |
| Grant date | May 30, 2023 |
| Priority date | — |
| Expiry date | Sep 6, 2040 |
Classification
- Technology area (CPC —)General
Abstract
A weight optimized stiffener for use in a semiconductor device is disclosed herein. In one example, the stiffener is made of AlSiC for its weight and thermal properties. An O-ring provides sealing between a top surface of the stiffener and a component of the semiconductor device and adhesive provides sealing between a bottom surface of the stiffener and another component of the semiconductor device. The stiffener provides warpage control for a lidless package while enabling direct liquid cooling of a chip or substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.