Thermal structures for heat transfer devices and spatial power-combining devices
US11665867B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 18, 2022 |
| Grant date | May 30, 2023 |
| Priority date | — |
| Expiry date | May 18, 2042 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P10/25
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Thermal structures and, more particularly, improved thermal structures for heat transfer devices and spatial power-combining devices are disclosed. A spatial power-combining device may include a plurality of amplifier assemblies and each amplifier assembly includes a body structure that supports an input antenna structure, an amplifier, and an output antenna structure. One or more heat sinks may be partially or completely embedded within a body structure of such amplifier assemblies to provide effective heat dissipation paths away from amplifiers. Heat sinks may include single-phase or two-phase materials and may include pre-fabricated complex thermal structures. Embedded heat sinks may be provided by progressively forming unitary body structures around heat sinks by additive manufacturing techniques.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.