System and method for generating and analyzing roughness measurements
US11670480B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 10, 2021 |
| Grant date | Jun 6, 2023 |
| Priority date | — |
| Expiry date | Jul 7, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/2817
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
In one embodiment, a method includes receiving measured linescan information describing a pattern structure of a feature, applying the received measured linescan information to an inverse linescan model that relates measured linescan information to feature geometry information, and identifying, based at least in part on the applying the received measured linescan model to the inverse linescan model, feature geometry information that describes a feature that would produce a linescan corresponding to the received measured linescan information. The method also includes determining, at least in part using the inverse linescan model, feature edge positions of the identified feature, analyzing the feature edge positions to determine errors in the manufacture of the pattern structure, and controlling a lithography tool based on the analysis of the feature edge positions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.