Bridge pick-up head for transferring semiconductor devices
US11670531B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 13, 2019 |
| Grant date | Jun 6, 2023 |
| Priority date | — |
| Expiry date | Jul 11, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/80
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A pick-up tool (PUT) includes a bridge pick-up head. The bridge pick-up head includes: a first bridge leg portion, a second bridge leg portion, and a bridge center portion between the first and second leg portions, the first and second bridge leg portions each including a top surface and side surfaces, the top surfaces of the first and second bridge leg portions extending above the bridge center portion; a bridge base portion on the bridge center portion, the bridge base portion including a bottom side on the bridge center portion, a top side that is smaller than the bottom side, and one or more sloped surfaces defined between the top and bottom sides; and a tip configured to attach with a semiconductor device on the top side of the bridge base portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.