Patent · US Active

Package comprising passive device configured as electromagnetic interference shield

US11670599B2 · kind B2 · utility

0Cited by

2References

24Claims

0Family size

Assignee

QUALCOMM Incorporated · US

Inventors

Jeahyeong Han · San Diego, US
David Fraser Rae · San Diego, US
Rajneesh Kumar · Poughkeepsie, US

Key dates

Filing date	Jul 9, 2020
Grant date	Jun 6, 2023
Priority date	—
Expiry date	Jul 9, 2040

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/19106
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Packages are configured to include an electromagnetic interference (EMI) shield. According to one example, a package includes a substrate, an electrical component, and an EMI shield. The substrate includes a first surface and a second surface. The electrical component may be coupled to the first side of the substrate. The EMI shield is formed with at least one passive device. The at least one passive device is coupled to the first surface of the substrate. The at least one passive device is located laterally to the at least one electrical component, and extends along at least a portion of the electrical component. Other aspects, embodiments, and features are also included.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.