Lead-free solder
US11673214B2 · kind B2 · utility
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Key dates
| Filing date | May 25, 2022 |
| Grant date | Jun 13, 2023 |
| Priority date | — |
| Expiry date | May 25, 2042 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC22C28/00
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A lead-free solder contains 93.0 mass % or more and 98.95 mass % or less of indium, 1.0 mass % or more and 4.0 mass % or less of tin, and an addition metal. The addition metal contains at least one of silver, antimony, copper, or nickel. The addition metal is neither indium nor tin. The total of mass percentage of the addition metal is 0.05 mass % or more and 6.0 mass % or less. The sum of the total mass percentage of the addition metal, the mass percentage of indium, and the mass percentage of tin is 100 mass % or less.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.