Retaining ring for CMP

US11673226B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Andrew J. Nagengast · Sunnyvale, US
• Christopher Heung-Gyun Lee · San Jose, US
• Thomas Li · Mountain View, US
• Anand N. Iyer · Cupertino, US
• Jie Diao · Fremont, US
• Huanbo Zhang · San Jose, US
• Erik S. Rondum · San Ramon, US
• Wei-Cheng Lee · Los Altos Hills, US
• Jeonghoon Oh · San Jose, US

Key dates

• Filing date: Jun 7, 2019
• Grant date: Jun 13, 2023
• Expiry date: Aug 25, 2041

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/68735
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A retaining ring includes a generally annular body having an inner surface to constrain a substrate, an outer surface, and a bottom surface. The bottom surface has a plurality of channels extending from the outer surface to the inner surface and a plurality of islands separated by the channels and providing a contact area to contact a polishing pad. Each channel includes a recessed region adjacent the outer surface such that the channel is deeper in the recessed region than in a remainder of the channel. The recessed region and the remainder of the channel each have substantially uniform depth.