Patent · US Active

Method for fabricating a plurality of time-of-flight sensor devices

US11675049B2 · kind B2 · utility

0Cited by

4References

12Claims

0Family size

Assignee

AMS AG · AT

Inventors

Harald Etschmaier · Graz, AT
Thomas Bodner · Seiersberg, AT

Key dates

Filing date	Oct 10, 2018
Grant date	Jun 13, 2023
Priority date	—
Expiry date	May 3, 2040

Classification

Technology area (CPC H)Electricity
CPC primaryH10F77/50
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A method for fabricating a plurality of Time-of-Flight sensor devices (1) comprises a step of providing a wafer (100) including a plurality of wafer portions (110) for a respective one of the Time-of-Flight sensor devices (1), wherein each of the wafer portions (110) includes a first light detecting area (10) and a second light detecting area (20) and a respective light emitter device (30). The respective light emitter device (30) and the respective first light detecting area (10) is encapsulated by a first volume (40) of a light transparent material (130), and the respective second light detecting area (20) is encapsulated by a second volume (50) of the light transparent material (130). Before singulation of the devices (1), an opaque material (60) is placed on the wafer portions (110) in a space (120) between the respective first and second volume (40, 50) of the light transparent material (130).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.