Thomas Bodner
11Patents
1h-index
11Co-inventors
43Inventor score
Filing activity: Dec 19, 2013 → Oct 23, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9852955B2 | Method and arrangement for analyzing a semiconductor element and method for manufacturing a semiconductor component | Electricity | 4 | Active |
| US9929035B2 | Method of producing a removable wafer connection and carrier for wafer support | Emerging Cross-Sectional Technologies | 1 | Active |
| US10943936B2 | Method of producing an optical sensor at wafer-level and optical sensor | Electricity | 0 | Active |
| US11271134B2 | Method for manufacturing an optical sensor and optical sensor | Electricity | 0 | Active |
| US11675049B2 | Method for fabricating a plurality of time-of-flight sensor devices | Electricity | 0 | Active |
| US12362230B2 | Method of producing a semiconductor body with a trench, semiconductor body with at least one trench and semiconductor device | Electricity | 0 | Active |
| US10734534B2 | Method of producing an optical sensor at wafer-level and optical sensor | Electricity | 0 | Active |
| US9991177B2 | Method and arrangement for analyzing a semiconductor element and method for manufacturing a semiconductor component | Electricity | 0 | Active |
| US11139207B2 | Method for manufacturing a semiconductor device and semiconductor device | Electricity | 0 | Active |
| US10847664B2 | Optical package and method of producing an optical package | Electricity | 0 | Active |
| US12100644B2 | Semiconductor device with through-substrate via and method of manufacturing a semiconductor device with through-substrate via | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.