Point-to-point module connection interface for integrated circuit generation
US11675959B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 18, 2021 |
| Grant date | Jun 13, 2023 |
| Priority date | — |
| Expiry date | Oct 18, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2115/10
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Systems and methods are disclosed for generation and testing of integrated circuit designs with point-to-point connections between modules. These may allow for the rapid design and testing (e.g. silicon testing) of processors and SoCs. For example, type parameterization may be used to generate point-to-point connections in a flexible manner. For example, a point-to-point connection between the source module and the sink module that includes one or more named wires specified by bundle type may be automatically generated based on using the bundle type as a type parameterization input. For example, these system and methods may be used to rapidly connect a custom processor design, including one or more IP cores, to a standard input/output shell for a SoC design to facilitate rapid silicon testing of the custom processor design.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.