Cantilevered leadframe support structure for magnetic wireless transfer between integrated circuit dies
US11676884B2 · kind B2 · utility
0Cited by
6References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 27, 2021 |
| Grant date | Jun 13, 2023 |
| Priority date | — |
| Expiry date | Dec 10, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A coupling device provides galvanic isolation using a leadframe that is configured to support two integrated circuit chips in a coplanar manner. Each chip contains an inductive coupling coil. The lead frame includes a set of bond pads for attaching bond wires to couple to the two integrated circuit chips. Two separated die attach pads support the two chips. Each die attach pad is configured to support one of the two integrated circuit chips with a plurality of cantilevered fingers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.