Benjamin Michael Sutton
11Patents
2h-index
8Co-inventors
39Inventor score
Filing activity: Jul 22, 2013 → Mar 2, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| USD860779S1 | Container | General | 8 | Active |
| US10256027B2 | Embedded coil assembly and production method | Electricity | 2 | Active |
| US10991641B2 | Cantilevered leadframe support structure for magnetic wireless transfer between integrated circuit dies | Electricity | 1 | Active |
| US10643929B2 | Cantilevered leadframe support structure for magnetic wireless transfer between integrated circuit dies | Electricity | 1 | Active |
| US9824811B2 | Embedded coil assembly and method of making | Emerging Cross-Sectional Technologies | 1 | Active |
| US10978239B2 | Embedded coil assembly and method of making | Emerging Cross-Sectional Technologies | 0 | Active |
| US11676884B2 | Cantilevered leadframe support structure for magnetic wireless transfer between integrated circuit dies | Electricity | 0 | Active |
| US10854370B2 | Embedded coil assembly and method of making | Emerging Cross-Sectional Technologies | 0 | Active |
| US11738404B2 | Method to eliminate dissimilar metal welds | Performing Operations; Transporting | 0 | Active |
| US9527728B2 | Integrated circuit package and method | Performing Operations; Transporting | 0 | Active |
| US11298774B2 | Method to eliminate dissimilar metal welds | Performing Operations; Transporting | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.