Semiconductor device and fabrication method for the same
US11676893B2 · kind B2 · utility
1Cited by
9References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 26, 2021 |
| Grant date | Jun 13, 2023 |
| Priority date | — |
| Expiry date | Oct 26, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/585
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A reliable semiconductor device and a method for preparing the reliable semiconductor device are provided. The semiconductor device includes at least one die comprising an integrated circuit region; a first recess region surrounding the integrated circuit region; and a second recess region surrounding the first recess region. A first columnar blocking structure is disposed in the first recess region and a second columnar blocking structure is disposed in the second recess region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.