Semiconductor package
US11676915B2 · kind B2 · utility
0Cited by
6References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 27, 2021 |
| Grant date | Jun 13, 2023 |
| Priority date | — |
| Expiry date | Jun 3, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3512
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package including a redistribution substrate with a first insulating layer, one or more second insulating layers on the first insulating layer, and a plurality of redistribution layers. The first insulating layer includes a first photosensitive resin having an elongation of 60% or more and toughness of 70 mJ/mm3 or more. The one or more second insulating layers include a second photosensitive resin having an elongation in a range of 10% to 40% and toughness of 40 mJ/mm3.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.