Doohwan Lee
37Patents
3h-index
54Co-inventors
66Inventor score
Filing activity: Dec 7, 2001 → Jan 3, 2024
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11139867B2 | Antenna displacement correction method and device for OAM multiplexing communication system | Electricity | 5 | Active |
| US11202211B2 | OAM multiplexing communication system and OAM multiplexing communication method | Electricity | 4 | Active |
| US11228363B2 | OAM multiplexing communication system and inter-mode interference elimination method | Electricity | 4 | Active |
| US11289456B2 | Semiconductor package | Electricity | 2 | Active |
| US10873376B2 | OAM multiplexing communication system, OAM multiplexing transmission device, OAM multiplexing receiving device, and OAM multiplexing communication method | Electricity | 1 | Active |
| US11355445B2 | Semiconductor packages | Electricity | 1 | Active |
| US11735532B2 | Semiconductor packages | Electricity | 1 | Active |
| US7758984B2 | Shift reactor, fuel cell system employing the same, and operating method of the same | Emerging Cross-Sectional Technologies | 1 | Active |
| US11444706B2 | Antenna module including communication module capable of determining abnormality of transmission or reception path | Electricity | 1 | Active |
| US11127646B2 | Fan-out semiconductor package | Electricity | 1 | Active |
| US12283446B2 | Switch and electronic device including the same | Performing Operations; Transporting | 0 | Active |
| US12205939B2 | Semiconductor package | Electricity | 0 | Active |
| US9136893B2 | Receiver | Electricity | 0 | Active |
| US8101306B2 | Fuel cell system with fuel reforming units | Emerging Cross-Sectional Technologies | 0 | Active |
| US11581263B2 | Semiconductor package, and package on package having the same | Electricity | 0 | Active |
| US11721577B2 | Semiconductor package and method of manufacturing the same | Electricity | 0 | Active |
| US11342239B2 | Semiconductor package | Electricity | 0 | Active |
| US11676915B2 | Semiconductor package | Electricity | 0 | Active |
| US11158581B2 | Semiconductor package having semiconductor chip between first and second redistribution layers | Electricity | 0 | Active |
| US11043446B2 | Semiconductor package | Electricity | 0 | Active |
| US11901301B2 | Semiconductor package | Electricity | 0 | Active |
| US6728463B2 | Optical attenuator using multi-mode interference | Physics | 0 | Expired |
| US11201397B2 | Circuit and wireless device | Electricity | 0 | Active |
| US12315822B2 | Methods of manufacturing a fan-out panel level semiconductor package | Electricity | 0 | Active |
| US11121069B2 | Semiconductor package including capping pad having crystal grain of different size | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.