Solder joints on nickel surface finishes without gold plating
US11676926B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 24, 2020 |
| Grant date | Jun 13, 2023 |
| Priority date | — |
| Expiry date | Dec 4, 2040 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for interconnecting two conductors includes creating a first nickel layer on a first conductor of an electrical component, producing a first non-gold protective layer on the first nickel layer, the first non-gold protective layer being configured to prevent the first nickel layer from oxidizing, creating a second nickel layer on a second conductor, producing a second non-gold protective layer on the second nickel layer, the second non-gold protective layer being configured to prevent the second nickel layer from oxidizing, and interconnecting the first and second nickel layers using a solder layer that interfaces with the first and second nickel layers between the first and second conductors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.