Flexible sinter tool for bonding semiconductor devices
US11676937B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 4, 2021 |
| Grant date | Jun 13, 2023 |
| Priority date | — |
| Expiry date | Jun 23, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/95
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus having a seal plate which includes rigid hard portions and one or more flexible soft portions located between the hard portions is used for bonding at least one semiconductor device onto a substrate that is supported on a platform. The seal plate is movable between a first position which is spaced from the substrate and a second position whereat a first side of the seal plate is configured to be in contact with the substrate. A diaphragm covers a second side of the seal plate opposite to the first side. A fluid pressure generator exerts a fluid pressure onto the diaphragm to actuate the diaphragm to compress the one or more soft portions to transmit a bonding force onto the at least one semiconductor device during bonding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.