Method and structure for dual sheet resistance trimmable thin film resistors
US11676993B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 8, 2020 |
| Grant date | Jun 13, 2023 |
| Priority date | — |
| Expiry date | Sep 8, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/5228
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In one example an electronic device includes a first resistor and a second resistor. The first resistor includes a first resistive layer located over a substrate, the first resistive layer having a first sheet resistance. The second resistor includes a first portion of a second resistive layer located over the substrate, the second resistive layer having a second sheet resistance different from the first sheet resistance. The first resistive layer is located between the substrate and a second noncontiguous portion of the second resistive layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.