Patent · US Active

3D integrated count

US11677401B2 · kind B2 · utility

0Cited by

4References

16Claims

0Family size

Assignee

IMEC VZW · BE

Inventors

Francky Catthoor · Temse, BE
Edouard Giacomin · Salt Lake City, US
Juergen Boemmels · Heverlee, BE
Julien Ryckaert · Schaerbeek - Schaarbeek, BE

Key dates

Filing date	May 10, 2022
Grant date	Jun 13, 2023
Priority date	—
Expiry date	May 10, 2042

Classification

Technology area (CPC H)Electricity
CPC primaryH10D89/10
WIPO fieldBasic communication processes
WIPO sectorElectrical engineering

Abstract

According to an aspect of the present inventive concept there is provided 3D IC, comprising:

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.