Hybrid integration of microLED interconnects with ICs
US11677472B2 · kind B2 · utility
1Cited by
2References
11Claims
0Family size
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Key dates
| Filing date | Aug 30, 2021 |
| Grant date | Jun 13, 2023 |
| Priority date | — |
| Expiry date | Aug 30, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10121
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
For optical communications between semiconductor ICs, optical transceiver assembly subsystems may be integrated with a processor. The optical transceiver assembly subsystems may be monolithically integrated with processor ICs or they may be provided in separate optical transceiver ICs coupled to or attached to the processor ICs.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.