Method for co-packaging light engine chiplets on switch substrate
US11677478B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 10, 2021 |
| Grant date | Jun 13, 2023 |
| Priority date | — |
| Expiry date | Aug 10, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04J14/0278
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A co-packaged optical module includes a substrate, a processor arranged on the substrate and a plurality of light engines mounted around the processor on the substrate using mounting assemblies configured to attach the respective light engines to the substrate. The light engines and the mounting assemblies are disposed along a perimeter of the substrate, including at corners of the substrate. Each of the mounting assemblies includes a socket, a metal clamp clamping a corresponding one of the light engines into the socket, and a plurality of pins which when mated with corresponding holes in the substrate cause peripheries of the mounting assemblies, including the light engines, the sockets and the metal clamps, to be flush with the perimeter of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.