Circuit board
US11678439B2 · kind B2 · utility
0Cited by
9References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 25, 2022 |
| Grant date | Jun 13, 2023 |
| Priority date | — |
| Expiry date | Feb 25, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/175
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board includes a substrate, a plurality of contacts disposed on a surface of the substrate, and a solder mask. The contacts have a plurality of plating regions and a metal layer on the plating regions, and the plating regions have at least two different sizes. The solder mask covers the surface of the substrate and covers edges of the plating regions, in which topmost surfaces of the contacts are below a top surface of the solder mask, and a gap between the topmost surfaces of the contacts and the top surface of the solder mask is larger than 0 μm and is smaller than 5 μm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.