Control of thermal interface material in multi-chip package
US11682603B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 25, 2021 |
| Grant date | Jun 20, 2023 |
| Priority date | — |
| Expiry date | Mar 27, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16195
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic system includes a plurality of heat sources. At least two of the plurality of heat sources vary in height and each of the plurality of heat sources includes a first side and a second side. The electronic system also includes a substrate having a first side and a second side. The second side of each of the plurality of heat sources is positioned adjacent to the first side of the substrate. The electronic system further includes a cover member provided above the plurality of heat sources and a sintering thermal interface material provided between the cover member and the first side of one of the at least two heat sources that vary in height.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.