Hermetic optical component package having organic portion and inorganic portion
US11682661B2 · kind B2 · utility
0Cited by
3References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 27, 2020 |
| Grant date | Jun 20, 2023 |
| Priority date | — |
| Expiry date | Apr 27, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/036
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A hermetic package includes a base body, wherein dielectric material of a bottom of the base body is made of an organic material, an optical component mounted on the base body, and inorganic material hermetically enclosing the optical component along all surrounding sides.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.