Hybrid material post-CMP brushes and methods for forming the same
US11684144B2 · kind B2 · utility
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20Claims
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Assignee
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Key dates
| Filing date | Jun 2, 2020 |
| Grant date | Jun 27, 2023 |
| Priority date | — |
| Expiry date | Aug 10, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/42
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Provided is disclosure for hybrid material post-CMP brushes and methods for forming the same. Embodiments of a hybrid material post-CMP brush may comprise at least two layers, where the hybrid brush is used to clean various surfaces, such as surfaces of semiconductor substrates. An example hybrid brush for cleaning a surface includes a mandrel, a molded first layer formed about the mandrel, where the molded first layer comprises a first material, and a molded second layer surrounding the molded first layer, where the molded second layer comprises a second material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.