Method of enhancing copper electroplating
US11686006B2 · kind B2 · utility
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1References
12Claims
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Key dates
| Filing date | Apr 1, 2022 |
| Grant date | Jun 27, 2023 |
| Priority date | — |
| Expiry date | Apr 1, 2042 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D7/123
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Crystal plane orientation enrichment compounds are applied to copper to modify copper grain orientation distribution to the favorable crystal plain orientation to enhance copper electroplating. Electroplating copper on the modified copper enables faster and selective electroplating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.