Electroplating apparatus and electroplating method
US11686008B2 · kind B2 · utility
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19Claims
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Key dates
| Filing date | May 16, 2022 |
| Grant date | Jun 27, 2023 |
| Priority date | — |
| Expiry date | May 16, 2042 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D17/007
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An electroplating apparatus including an anode and a cathode, a power supply, and a regulating plate is provided. The power supply is electrically connected to the anode and the cathode. The regulating plate is arranged between the anode and the cathode. The regulating plate includes an insulating grid plate and a plurality of magnetic components. The plurality of magnetic components are uniformly and randomly arranged on the insulating grid plate. An electroplating method is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.