Semiconductor device and method for manufacturing the same
US11688647B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 28, 2021 |
| Grant date | Jun 27, 2023 |
| Priority date | — |
| Expiry date | Dec 31, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D30/797
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes an N-type fin-like field effect, a P-type fin-like field effect transistor, a shallow trench isolation (STI) structure, a first interlayer dielectric (ILD) layer, and a second ILD layer. The N-type fin-like field effect transistor includes a first semiconductor fin, a gate structure across the first semiconductor fin, and a first source/drain feature in contact with the first semiconductor fin. The P-type fin-like field effect transistor includes a second semiconductor fin, the gate structure across the second semiconductor fin, and a second source/drain feature in contact with the second semiconductor fin. The structure surrounds the first and second semiconductor fins. The first interlayer dielectric (ILD) layer covers the first source/drain feature. The second ILD layer covers the second source/drain feature, wherein a porosity of the second ILD layer is greater than a porosity of the first ILD layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.