Semiconductor structure and fabrication method thereof
US11688798B2 · kind B2 · utility
Assignees
Inventor
Key dates
| Filing date | Apr 1, 2021 |
| Grant date | Jun 27, 2023 |
| Priority date | — |
| Expiry date | Sep 15, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76883
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor structure and a method for forming the semiconductor structure are provided. The semiconductor structure includes a substrate including a first region and a second region, a first gate structure over the first region, and first source-drain doped layers in the first region of the substrate on both sides of the first gate structure. The semiconductor structure also includes a second gate structure over the second region, and second source-drain doped layers in the second region of the substrate on both sides of the second gate structure. Further, the semiconductor structure includes a first protection layer over the second gate structure, a first conductive structure over a first source-drain doped layer, and an isolation layer over the first conductive structure. The first conductive structure is also formed on the first gate structure, and the first conductive structure has a top surface lower than the first protection layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.