Microelectromechanical system (MEMS) vibration sensor having a segmented backplate

US11691871B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Somu Goswami · Munich, DE
• Christian Bretthauer · Munich, DE
• Matthias Herrmann · Hildesheim, DE
• Gunar Lorenz · Voisins-le-Bretonneux, FR

Key dates

• Filing date: Jun 18, 2021
• Grant date: Jul 4, 2023
• Expiry date: Jun 18, 2041

Classification

• Technology area (CPC H): Electricity
• CPC primary: H04R2201/003
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A MEMS vibration sensor includes a membrane having an inertial mass, the membrane being affixed to a holder of the MEMS vibration sensor; and a segmented backplate spaced apart from the membrane, the segmented backplate being affixed to the holder.