Intermediate raw material, and polishing composition and composition for surface treatment using the same
US11692137B2 · kind B2 · utility
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1References
6Claims
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Key dates
| Filing date | Sep 27, 2021 |
| Grant date | Jul 4, 2023 |
| Priority date | — |
| Expiry date | Sep 27, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/3212
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An intermediate raw material according to the present invention includes a charge control agent having a critical packing parameter of 0.6 or more and a dispersing medium and a pH of the intermediate raw material is less than 7.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.