Molded range and proximity sensor with optical resin lens
US11693149B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Aug 25, 2021 |
| Grant date | Jul 4, 2023 |
| Priority date | — |
| Expiry date | Aug 25, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73265
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for forming a molded proximity sensor with an optical resin lens and the structure formed thereby. A light sensor chip is placed on a substrate, such as a printed circuit board, and a diode, such as a laser diode, is positioned on top of the light sensor chip and electrically connected to a bonding pad on the light sensor chip. Transparent, optical resin in liquid form is applied as a drop over the light sensor array on the light sensor chip as well as over the light-emitting diode. After the optical resin is cured, a molding compound is applied to an entire assembly, after which the assembly is polished to expose the lenses and have a top surface flush with the top surface of the molding compound.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.