High-density optical waveguide structure and printed circuit board and preparation method thereof

US11693181B2 · kind B2 · utility

Assignee

• TTM Technologies, Inc. · US

Inventors

• Xinhong Shi · Shanghai, CN
• Haitao Fu · Shanghai, CN
• Jun-Liang Zhang · Nanhu, CN
• Huamei Zhou · Shanghai, CN
• Longxiu Zhu · Shanghai, CN
• Marika Immonen · Turku, FI

Key dates

• Filing date: Jul 8, 2019
• Grant date: Jul 4, 2023
• Expiry date: Jul 8, 2039

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K2201/09036
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

The disclosure relates to a high-density optical waveguide structure, a printed circuit board and a preparation method thereof. The high-density optical waveguide structure comprises an undercladding layer, a core layer and an upper cladding layer in sequence; wherein, the lower cladding layer is arranged at intervals. The trench is filled with an optical waveguide material to form a core layer. The waveguide structure integrates an optical waveguide into a PCB to realize photoelectric interconnection. The waveguide structure can better achieve higher parallel interconnection density, maintain good signal integrity, reduce device and device size, and at the same time, consume less power. The structure is configured to easily dissipate heat, enabling a simpler physical architecture and design, maximizing the wiring space of printed circuit boards, facilitating the fabrication of ultra-fine wire boards; and improving the wiring density and reliability of existing manufacturing methods.