Electronic device and fabrication method thereof
US11694999B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 29, 2020 |
| Grant date | Jul 4, 2023 |
| Priority date | — |
| Expiry date | Jun 29, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0364
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic device and a fabrication method thereof are provided. The electronic device includes a circuit structure layer, a package structure, an electronic element, and a plurality of function elements. The circuit structure layer has a first side and a second side opposite to the first side. The package structure is disposed on the first side of the circuit structure layer. The electronic element is embedded or encapsulated in the package structure. The function elements are disposed on the second side of the circuit structure layer. The function elements are electrically connected to the electronic element through the circuit structure layer. The electronic device provided by the disclosure exhibits borderless design or has a large function region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.