Photonic package device and method for fabricating the same
US11698489B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 18, 2022 |
| Grant date | Jul 11, 2023 |
| Priority date | — |
| Expiry date | Feb 18, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B2006/12121
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method for fabricating a photonic package device is provided. The method includes patterning a semiconductor layer of a semiconductor-on-insulator (SOI) substrate into a waveguide structure and at least one first semiconductor pillar; forming a metal-dielectric stack over the waveguide structure and the first semiconductor pillar; etching an opening in the metal-dielectric stack to expose the first semiconductor pillar; etching an insulator layer of the SOI substrate to form at least one insulator cap below the first semiconductor pillar; and etching a base semiconductor substrate of the SOI substrate to form at least one second semiconductor pillar below the insulator cap.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.