Magnetic thin film laminated structure deposition method
US11699541B2 · kind B2 · utility
1Cited by
4References
15Claims
0Family size
Assignee
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Key dates
| Filing date | Apr 17, 2019 |
| Grant date | Jul 11, 2023 |
| Priority date | — |
| Expiry date | Dec 6, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01F10/14
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A deposition method includes depositing an adhesive layer on a workpiece to be processed and depositing a magnetic/isolated unit, where the magnetic/isolation unit includes at least one pair of a magnetic film layer and an isolation layer that are alternately disposed. The deposition method of the magnetic thin film laminated structure, the magnetic thin film laminated structure and the micro-inductive device provided by the disclosure can increase a total thickness of the magnetic thin film laminated structure, thereby broadening the application frequency range of the inductive device fabricated thereby.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.