Si-containing film forming precursors and methods of using the same
US11699584B2 · kind B2 · utility
1Cited by
43References
18Claims
0Family size
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Key dates
| Filing date | Mar 10, 2021 |
| Grant date | Jul 11, 2023 |
| Priority date | — |
| Expiry date | Jul 26, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02164
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Methods are disclosed for forming a Silicon Metal Oxide film using a mono-substituted TSA precursor. The precursors have the formula: (SiH3)2N—SiH2-X, wherein X is selected from a halogen atom; an isocyanato group; an amino group; an N-containing C4-C10 saturated or unsaturated heterocycle; or an alkoxy group.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.