Substrate processing method
US11699601B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 27, 2021 |
| Grant date | Jul 11, 2023 |
| Priority date | — |
| Expiry date | Jun 27, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67757
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate processing device includes a processing tank, a substrate holding unit, a fluid supply unit, and a control unit. The processing tank stores a processing liquid for processing a substrate. The substrate holding unit holds the substrate in the processing liquid in the processing tank. The fluid supply unit supplies a fluid to the processing tank. The control unit controls the fluid supply unit. The control unit controls the fluid supply unit such that the fluid supply unit changes supply of the fluid during a period from a start of supply of the fluid to the processing tank storing the processing liquid in which the substrate is immersed to an end of supply of the fluid to the processing tank storing the processing liquid in which the substrate is immersed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.