Apparatus for treating substrate
US11699605B2 · kind B2 · utility
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20Claims
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Assignee
Inventors
Key dates
| Filing date | May 11, 2020 |
| Grant date | Jul 11, 2023 |
| Priority date | — |
| Expiry date | Sep 9, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6875
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for treating a substrate includes a chamber having a treating space formed therein, a substrate support unit that supports the substrate in the treating space, a plate that is located to face the substrate support unit in the treating space and that has a plurality of holes formed therein, a gas supply unit that supplies gas into the treating space through the holes, and a gas exhaust unit that exhausts the gas in the treating space through the holes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.