Heat-sound-vibration three-parameter integrated in-situ sensor and system of high-temperature-resistant and high-pressure-resistant structure
US11703377B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 9, 2022 |
| Grant date | Jul 18, 2023 |
| Priority date | — |
| Expiry date | Feb 9, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01K11/3213
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present disclosure relates to a thermal-acoustic-vibration three-parameter integrated in-situ sensor and system with a high-temperature-resistant and high-pressure-resistant structure. The provided thermal-acoustic-vibration three-parameter integrated in-situ sensor with a high-temperature-resistant and high-pressure-resistant structure comprises a heat detection device, a sound detection device and a vibration detection device; and the sound detection device and the vibration detection device are distributed on two sides of the heat detection device. When heat, sound and vibration need to be detected, only spectra of light signals emitted by the heat detection device, the sound detection device and the vibration detection device need to be obtained, and heat information, sound information and vibration information to be detected are obtained through the corresponding relation between the spectra of the optical signals emitted by the heat detection device, the sound detection device and the vibration detection device and heat information, sound information and vibration information to be detected.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.