Patent · US Active

Semiconductor inspecting method for ensuring scrubbing length on pad

US11703541B2 · kind B2 · utility

0Cited by

5References

7Claims

0Family size

Inventors

Volker Hansel · Coswig, DE
Sebastian Giessmann · Großenhain, DE
Frank Fehrmann · Hengshan, TW
Chien-Hung Chen · Taipei, TW

Key dates

Filing date	Nov 12, 2021
Grant date	Jul 18, 2023
Priority date	—
Expiry date	Nov 12, 2041

Classification

Technology area (CPC H)Electricity
CPC primaryH01L22/12
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A semiconductor inspecting method for ensuring a scrubbing length on a pad includes following steps. First off, a first position of a probe needle from above is defined. In addition, a wafer comprising at least a pad is placed on a wafer chuck of a semiconductor inspecting system. Thereafter, a relative vertical movement between the probe needle and the pad is made by adopting a driving system of the semiconductor inspecting system to generate a scrubbing length on the pad. Next, whether the scrubbing length is equal to or larger than a preset value or not is recognized by adopting the vision system and the relative vertical movement is stopped by adopting the driving system.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.